Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review

Author:

Suhir E.1

Affiliation:

1. Bell Laboratories, Lucent Technologies, Inc., 600 Mountain Ave., Room 1D-443, Murray Hill, NJ 07974

Abstract

We examine some attributes of modeling of the mechanical behavior of materials and structures in microelectronics and photonics (mainly fiber optics) engineering. The merits and shortcomings of experimental and theoretical modeling are addressed, as well as the interaction between different modeling approaches. The concepts discussed are illustrated by a brief review of the published work in the field. The review is based primarily on the author’s research conducted during his work at Bell Laboratories and reflects, to a great extent, the state-of-the-art in modeling of the mechanical behavior of “high-tech” materials and structures. “The only real voyage to discovery consists not in seeking new landscapes, but in having new eyes.” [Marcel Proust, French Writer] “The Practical value of mathematics is, in effect, a possibility to obtain, with its help, results simpler and faster.” [Andrey Kolmogorov, Russian Mathematician]

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference122 articles.

1. Aleck, B. J., 1949, “Thermal Stresses in a Rectangular Plate Clamped Along and Edge,” ASME Journal Of Applied Mechanics, Vol. 16.

2. Bailey, C., Gebreamlak, S., Norman, P., 1997, “Computational Modeling of Defects in Fibre Optic Cables,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.

3. Buratynski, E. K., 1997, “Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.

4. Burchett, S. N., Neilsen, M. K., Frear, D. R., 1977, “Computational Continuum Modeling of Solder Interconnects: Applications,” Advances in Electronic Packaging, E. Suhir et al., eds., ASME, New York.

5. Chen W. T., and Nelson, C. W., 1979, “Thermal Stresses in Bonded Joints,” IBM Journal, Research and Development, Vol. 23, No. 2.

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