Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding
Author:
Funder
UCLA CHIPS
UCOP
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/ac0a52/pdf
Reference29 articles.
1. Wafer-level 3D integration technology;Koester;IBM J. Res. Dev.,2008
2. Heterogeneous integration at fine pitch (≤10 μm) using thermal compression bonding;Bajwa,2017
3. Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol;Tan;Appl. Phys. Lett.,2009
4. Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement;Tan;Microelectron. Reliab.,2012
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures;Applied Surface Science;2024-07
2. Investigation of surface properties of biocomposite materials modified by corona plasma treatment;Proceedings of the Voronezh State University of Engineering Technologies;2023-09-02
3. Thermal Finite Element Simulation of Ultrafine Pitch Chip-to-Wafer Hybrid Bonding;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
4. Biocomposite materials based on polyethylene and amphiphilic polymer-iron metal complex;Fine Chemical Technologies;2023-05-27
5. A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3