Author:
Tan C.S.,Lim D.F.,Ang X.F.,Wei J.,Leong K.C.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Wafer level 3-D ICs process technology;Tan,2008
2. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
3. Copper Wafer Bonding
4. Silicon Multilayer Stacking Based on Copper Wafer Bonding
5. Jourdain A, Stoukatch S, De Moor P, Ruythooren W, Pargfrieder S, Swinnen B et al. In: IEEE international interconnect technology conference, IEEE; 2007. p. 207–9.
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