A Study on the Bromine-induced Corrosion/Defects in Wafer Fabrication
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Publisher
Journal of Engineering Research and Sciences
Link
http://www.jenrs.com/publications/JENRS_0302002.pdf
Reference9 articles.
1. Y. N. Hua, S. Redkar, C. K. Lau, Z. Q. Mo; November 3-7, 2002. "A Study on Non-Stick Aluminium Bondpads Due to Fluorine Contamination Using SEM, EDX, TEM, IC, AUGER, XPS and TOF-SIMS Techniques." Proceedings of the ISTFA 2002. ISTFA 2002: Conference Proceedings from the 28th International Symposium for Testing and Failure Analysis. Phoenix, Arizona, USA, pp. 495-504, 2002, DOI:10.31399/asm.cp.istfa2002p0495
2. Y. N. Hua, S. Redkar, Ron Dickinson, S. L. Peh, Shirley; November 2-6, 2003. "A Study on Fluorine-Induced Corrosion on Microchip Aluminum Bondpads." Proceedings of the ISTFA 2003. ISTFA 2003: Conference Proceedings from the 29th International Symposium for Testing and Failure Analysis. Santa Clara, California, USA, pp. 249-255, 2003, DOI:10.31399/asm.cp.istfa2003p0249
3. Y. Hua, L. Liao, L. Binghai, L. Zhu and X. Li, "Failure Analysis & Mechanism Studies of the Worm-like Defects in Vias of Wafer Fabrication," 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), Singapore, Singapore, pp. 50-52, 2021, doi: 10.1109/EPTC53413.2021.9663918.
4. Hua Younan, Liu Binghai, Mo Zhiqiang and J. Teong, "Studies and applications of standardless EDX quantification method in failure analysis of wafer fabrication," 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore, pp. 1-6, 2008, doi: 10.1109/IPFA.2008.4588206.
5. Y. Hua et al., "Studies of Determination Method of TiN Residue on Al Bondpads," 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Pulau Pinang, Malaysia, pp. 1-4, 2023, doi: 10.1109/IPFA58228.2023.10249105.
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