Superhydrophobic Copper Surfaces with Anticorrosion Properties Fabricated by Solventless CVD Methods-Reference-Cited by-同舟云学术

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Superhydrophobic Copper Surfaces with Anticorrosion Properties Fabricated by Solventless CVD Methods

Published:2016-12-30 Issue:1 Volume:9 Page:1057-1065
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Vilaró Ignasi¹,Yagüe Jose L.¹^ORCID,Borrós Salvador¹²

Affiliation:

1. Grup d’Enginyeria de Materials (GEMAT), IQS-School of Engineering, Ramon Llull University, Via Augusta 390, 08017 Barcelona, Spain

2. Centro de Investigación Biomédica en Red en Bioingeniería, Biomateriales y Nanomedicina (CIBER-BBN), 50018 Zaragoza, Spain

Funder

Research Executive Agency

Seventh Framework Programme

Agència de Gestió d'Ajuts Universitaris i de Recerca

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.6b12119

Reference49 articles.

1. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

2. Technology and reliability constrained future copper interconnects. II. Performance implications

3. Three-dimensional integrated circuits

4. Copper direct bonding: An innovative 3D interconnect

5. Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications

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