Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications-Reference-Cited by-全球学者库

Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications

Published:2002-01 Issue:3-4 Volume:185 Page:289-297
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Rohan James F,O’Riordan Gerald,Boardman Jane

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference8 articles.

1. Electroless nickel/immersion gold finishes for application to surface mount technology: A regenerative approach

2. M. Paunovic, M. Schlesinger, Fundamentals of Electrochemical Deposition, Electrochemical Society Series, Wiley/Interscience, New York, 1998, p. 147.

3. The Morphology of Electroless Ni Deposition on a Colloidal Pd(II) Catalyst

4. G.O. Mallory, Plating 58 (April 1971) 319.

5. The Effect of Solution pH and Heat‐Treatment on the Properties of Electroless Nickel Boron Films

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