Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
Author:
Affiliation:
1. Heat & Surface Technology R&D Department, Korea Institute of Industrial Technology (KITECH), Incheon21999, Republic of Korea
2. Department of Materials Engineering, Korea Aerospace University, Goyang10540, Republic of Korea
Funder
National Research Foundation of Korea
Publisher
American Chemical Society (ACS)
Subject
General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acsomega.2c05646
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1. Defect inspection of flip chip solder joints based on non-destructive methods: A review
2. Copper pillar bump technology progress overview
3. Method to Improve the Process Efficiency for Copper Pillar Electroplating
4. The Role of Organic Additives in the Localized Copper Plating: Flat, Dish, and Domed Shape Copper Bumps
5. Back-end Copper Metallization for Advanced Packaging : Bump, RDL, and TSV
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