On the role of complexing agents in co-electrodeposition of SnAg alloy with uniform composition
Author:
Funder
National Research Foundation of Korea
Ministry of Education
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference41 articles.
1. Solder joint fatigue models: review and applicability to chip scale packages;Lee;Microelectron. Reliab.,2000
2. Design and optimization of thermo-mechanical reliability in wafer level packaging;Fan;Microelectron. Reliab.,2010
3. Complexation behavior and Co-electrodeposition mechanism of Au-Sn alloy in highly stable non-cyanide bath;Huang;J. Electrochem. Soc.,2018
4. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R Rep.,2002
5. Electrochemical processing technologies in chip fabrication: challenges and opportunities;Datta;Electrochim. Acta,2003
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2. Influence of Complexing Agents on Attaining Homogeneous Composition in SnAg Electroplating;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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