Author:
Fried L. J.,Havas J.,Lechaton J. S.,Logan J. S.,Paal G.,Totta P. A.
Cited by
58 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Michael Hatzakis, semiconductor industry pioneer;Micro and Nano Engineering;2024-09
2. Packaging Assembly Techniques;Handbook of Fiber Optic Data Communication;2008
3. Chip Integration;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
4. Metallization;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
5. Fluxless fabrications of Sn-Au solder microbumps by a hydrogen plasma reflow technique;Journal of Electronic Materials;2005-05