Packaging Assembly Techniques-Reference-Cited by-同舟云学术

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Packaging Assembly Techniques

Published:2008 Issue: Volume: Page:219-238
ISSN:
Container-title:Handbook of Fiber Optic Data Communication
language:
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Author:

Raskin Glenn

Publisher

Elsevier

Reference16 articles.

1. Bell Laboratories Record;Anderson,1975

2. Assembly techniques and packaging;Steidel,1982

3. A critical review of VLSI die-attachment in high reliability application;Shukla;Solid State Tech,1985

4. Chip-to-package interconnections;Koopman,1989

5. Tape automated bonding process for high lead count LSI;Kawanobe,1983

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array;Journal of Cleaner Production;2020-12

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