Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation-Reference-Cited by-同舟云学术

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Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

Published:2014-09 Issue: Volume:613 Page:336-339
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Xiao Gesheng,Yuan Guozheng,Jia Chunnan,Yang Xuexia,Li Zhigang,Shu Xuefeng

Funder

National Natural Science Foundation of China, China

Postgraduate Excellent Innovation Project of Shanxi province

International Scientific Cooperation Project of Shanxi Province

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference22 articles.

1. Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

2. Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

3. Mechanical property and fracture behavior characterizations of 96.5 Sn–3.0 Ag–0.5 Cu solder joints

4. Interfacial fracture toughness of Pb-free solders

5. Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles

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1. Creep behavior of epoxy adhesives subjected to different hygrothermal aging conditions—nanoindentation creep tests and theoretical study;Polymer Degradation and Stability;2024-11

2. Strain rate-dependent tensile deformation and failure behavior in single-crystal β-Sn;Modern Physics Letters B;2024-04-27

3. Effect of Strain Rate on Nano-Scale Mechanical Behavior of A-Plane (112¯0) ZnO Single Crystal by Nanoindentation;Micromachines;2023-02-08

4. Porosity effect on the mechanical properties of nano-silver solder;Nanotechnology;2023-02-06

5. Current-carrying tribological properties of an elastic roll ring under different currents;Wear;2023-02

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