Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference41 articles.
1. Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates
2. Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions
3. Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance
4. Rupture time analyses of the Sn–3.5Ag solder alloys containing Cu or Bi
5. Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions
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3. Comparing the Solderability of Different SA C0307 Composite Solder Pastes;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
4. Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study;Ceramics International;2023-07
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