Characterization of ultra-thin nickel–silicide films synthesized using the solid state reaction of Ni with an underlying Si:P substrate (P: 0.7 to 4.0%)
Author:
Funder
imec core CMOS program members
Publisher
Elsevier BV
Reference47 articles.
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2. Characterization and analysis of epitaxial silicon phosphorus alloys for use in n-channel transistors
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4. Disilane-based cyclic deposition/etch of Si, Si:P and Si1−yCy:P layers: I. The elementary process steps
5. Selective Epitaxial Si:P Film for nMOSFET Application: High Phosphorous Concentration and High Tensile Strain
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1. Charge redistribution to reduce contact resistivity in NiSi/Si system through interface modification: A first-principles study;Applied Physics Letters;2025-03-01
2. Growth of low resistive nickel mono-silicide phase under low energy Si ion irradiation at room temperature;Thin Solid Films;2021-09
3. Defect reduction and dopant activation of in situ phosphorus-doped silicon on a (111) silicon substrate using nanosecond laser annealing;Applied Physics Express;2021-01-12
4. Dopant Activation of In Situ Phosphorus‐Doped Silicon Using Multi‐Pulse Nanosecond Laser Annealing;physica status solidi (a);2020-03-05
5. Effect of P Concentration on Ti Silicide Formation in In‐Situ P Doped Epitaxial Si Films;physica status solidi (a);2019-01-24
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