A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications-Reference-Cited by-同舟云学术

A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications

Published:2015-08 Issue:9-10 Volume:55 Page:1815-1820
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Sauveplane J.B.,Retho P.,Venet N.,Buso D.,Perez G.,Lefrileux J.S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Reliability of column/board/CCGA attachment;Ghaffarian,2012

2. An efficient means to meet the challenges of very high density packaging in space applications;Berthet,2003

3. Board level reliability testing of hermetic packages equipped with high-rel interconnection solutions dedicated to space applications;Gaillard,2013

4. Reliability evaluation of high-density mounting technology;Nakagawa,2012

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