A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding
Author:
Funder
MEXT | Japan Society for the Promotion of Science
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://www.nature.com/articles/s41598-018-37693-2.pdf
Reference34 articles.
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4. Sauveplane, J. B. et al. A reliable solderless connection technique for high I/O counts ceramic land grid array package for space applications. Microelectron. Reliab. 55, 1815–1820 (2015).
5. Zeng, K. & Tu, K. N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R. 38, 55–105 (2002).
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