Electrorecrystallization of Metal Alloy-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Electrorecrystallization of Metal Alloy

Published:2013-02 Issue: Volume:549 Page:190-194
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Chiu Ying-Ta,Lin Kwang-Lung,Wu Albert T.,Jang Wei-Luen,Dong Chung-Li,Lai Yi-Shao

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference23 articles.

1. Electromigration in thin aluminum films on titanium nitride

2. Electromigration damage in mechanically deformed Al conductor lines: dislocations as fast diffusion paths

3. Stress generation by electromigration

4. Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

5. Effect of current crowding on vacancy diffusion and void formation in electromigration

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electric current stressing enhanced damping properties in Sn5Sb solder;Soldering & Surface Mount Technology;2024-04-25

2. Effect of electric current stressing on mechanical performance of solders and solder joints: A review;Journal of Materials Science;2022-09-28

3. Simulating electric field and current density in nanostructured electrocatalysts;Physical Chemistry Chemical Physics;2022

4. A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property;Acta Materialia;2020-11

5. Research Progress in Preparation and Purification of Rare Earth Metals;Metals;2020-10-15

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3