The rise of conductive copper inks: challenges and perspectives-Reference-Cited by-同舟云学术

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The rise of conductive copper inks: challenges and perspectives

Published:2020-03 Issue: Volume:18 Page:100451
ISSN:2352-9407
Container-title:Applied Materials Today
language:en
Short-container-title:Applied Materials Today

Author:

Li Wanli,Sun Qingqing,Li Lingying,Jiu Jinting,Liu Xu-Ying,Kanehara Masayuki,Minari Takeo,Suganuma Katsuaki

Funder

Grant-In-Aid for Scientiﬁc Research

Ministry of Education, Culture, Sport, Science, and Technology of Japan

New Energy and Industrial Technology Development Organization

Publisher

Elsevier BV

Subject

General Materials Science

Reference267 articles.

1. Introduction to Printed Electronics;Suganuma,2014

2. Organic materials for printed electronics;Berggren;Nat. Mater.,2007

3. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials;Perelaer;J. Mater. Chem.,2010

4. Conductive nanomaterials for printed electronics;Kamyshny;Small,2014

5. Rapid and versatile photonic annealing of graphene inks for flexible printed electronics;Secor;Adv. Mater.,2015

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1. Low-temperature copper sinter-joining technology for power electronics packaging: A review;Journal of Materials Processing Technology;2024-11

2. Hybrid Cu sinter paste for low temperature bonding of bare semiconductors;Materials Letters;2024-10

3. Tripiperidinium pentaformato copper(II) – A unique homoleptic Cu(II) formate;Inorganic Chemistry Communications;2024-09

4. Study on the Technology and Properties of Green Laser Sintering Nano-Copper Paste Ink;Nanomaterials;2024-08-31

5. Relationship of the Thermal Decomposition Temperature and Stretching Mode Wavenumber Shift of Amine-Copper Formate Complex: FTIR Spectrum Reveals the Decomposition Temperature of Copper Formate Moiety;MATERIALS TRANSACTIONS;2024-08-01

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