Hybrid Cu sinter paste for low temperature bonding of bare semiconductors
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Published:2024-10
Issue:
Volume:372
Page:136973
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ISSN:0167-577X
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Container-title:Materials Letters
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language:en
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Short-container-title:Materials Letters
Author:
Elger GordonORCID,
Krishna Bhogaraju Sri,
Schneider-Ramelow Martin
Reference12 articles.
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