The use of surfactants and supercritical CO2 assisted processes in the electroless nickel plating of printed circuit board with blind via
Author:
Funder
Ministry of Science and Technology, Taiwan
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference39 articles.
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2. Copper electroplating of PCB interconnects using megasonic acoustic streaming;Jones;Ultrason. Sonochem.,2018
3. Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications;Arra;J. Electron. Mater.,2004
4. Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications;Rohan;Appl. Surf. Sci.,2002
5. Characterisation of the electroless nickel deposit as a barrier layer/under bump metallurgy on IC metallization;Rohan;Microelectron. Eng.,2003
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