Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics
Reference10 articles.
1. Advanced IGBT modules for railway traction applications: Reliability testing;Berg;Microelectronics Reliability,1998
2. Lifetime Prediction on the Base of Mission Profiles;Ciappa;Microelectronics Reliability,2005
3. A fast mechanical test technique for life time estimation of micro-joints;Khatibi;Microelectronics Reliability,2008
4. Design for reliability of power electronic modules;Lu;Microelectronics Reliability,2009
5. Selected failure mechanisms of modern power modules;Ciappa;Microelectronics Reliability,2002
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4. Discussion on the Test Methodologies for Structural Integrity of Power Module;Journal of The Japan Institute of Electronics Packaging;2021-09-01
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