Author:
Khatibi G.,Wroczewski W.,Weiss B.,Licht T.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Electronic failure analysis handbook;Martin,1999
2. Material failure mechanisms and damage models;Dasgupta;IEEE Trans Reliab,1991
3. Tutorial: temperature as an input to microelectronics – reliability models;Lall;IEEE Trans Reliab,1996
4. EIA/JESD22-B116 July 1998. Wire bond shear test method.
5. IEC 60749-25 ED. 1.0 B: 2003. Semiconductor devices-mechanical and climatic test methods-Parts 25: Temperature cycling.
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