Effective thermo-electric-mechanical modeling of capacitively coupled plasma in low-pressure conditions: Modeling and application in dry etching-Reference-Cited by-同舟云学术

Effective thermo-electric-mechanical modeling of capacitively coupled plasma in low-pressure conditions: Modeling and application in dry etching

Published:2024-03 Issue: Volume:127 Page:32-59
ISSN:0307-904X
Container-title:Applied Mathematical Modelling
language:en
Short-container-title:Applied Mathematical Modelling

Author:

Sim Jin-Woo,Kim Tae-Hyun^ORCID,Kang Nayoon,Lee Hae June,Lee Eun-Ho^ORCID

Publisher

Elsevier BV

Subject

Applied Mathematics,Modeling and Simulation

Reference54 articles.

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3. Particle and fluid simulations of low-temperature plasma discharges: benchmarks and kinetic effects;Kim;J. Phys. D Appl. Phys.,2005

4. Simulation of Low Pressure Plasma Processing Reactors: Kinetics of Electrons and Neutrals, 25th Intern. Symp;Arslanbekov;Rarefied Gas Dynamics, St. Petersburg, Book of Abstracts,2006

5. Two-dimensional model of a capacitively coupled rf discharge and comparisons with experiments in the Gaseous Electronics Conference reference reactor;Boeuf;Physical Review E,1995

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