Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging-Reference-Cited by-同舟云学术

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Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging

Published:2024-09 Issue: Volume:180 Page:104073
ISSN:0749-6419
Container-title:International Journal of Plasticity
language:en
Short-container-title:International Journal of Plasticity

Author:

Oh Sung-Hyun^ORCID,Lee Hyun-Dong^ORCID,Lee Jae-Uk^ORCID,Park Sung-Ho,Cho Won-Seob,Park Yong-Jin,Haag Alexandra,Watanabe Soichi,Arnold Marco,Lee Hoo-Jeong,Lee Eun-Ho^ORCID

Funder

National Research Foundation of Korea

Korea Ministry of Trade Industry and Energy

BASF SE

Publisher

Elsevier BV

Reference66 articles.

1. Impact of thermal annealing and other process parameters on hybrid bonding performance for 3D advanced assembly technology;Ajayi,2023

2. Plane stress yield function for aluminum alloy sheetsNpart 1: theory;Barlat;Int. J. Plast.,2003

3. Thermomechanical finite element modeling of Cu–SiO2 direct hybrid bonding with a dishing effect on Cu surfaces;Beilliard;Int. J. Solids. Struct.,2017

4. Continuum modelling of semiconductor heteroepitaxy: an applied perspective;Bergamaschini;Adv. Phys. X.,2016

5. Nonlinear Continuum Mechanics of Solids: Fundamental Mathematical and Physical Concepts;Başar,2000

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