Tailoring intrinsic properties for tetrahedral carbon/copper composites construction via electronic interface engineering-Reference-Cited by-同舟云学术

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Tailoring intrinsic properties for tetrahedral carbon/copper composites construction via electronic interface engineering

Published:2024-03 Issue: Volume:46 Page:104151
ISSN:2468-0230
Container-title:Surfaces and Interfaces
language:en
Short-container-title:Surfaces and Interfaces

Author:

Xing Xiaolei,Jiang Hao,Cui Zhigang,Zhang Silong,Yang Qingxiang,Wang Dianlong,Zhou Yefei^ORCID,Shi Zhijun^ORCID

Publisher

Elsevier BV

Reference46 articles.

1. Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation;Peng;Chem. Eng. Journal,2023

2. Thermal properties of carbon nanotube–copper composites for thermal management applications;Chu;Nanoscale Res. Lett.,2010

3. Direct observation of elastic strain and relaxation at a metal-metal interface by Auger electron diffraction: cu/Ni(001);Chambers;Phys. Rev. B,1986

4. High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites;Li;Scr. Mater.,2015

5. Effects of Ag addition on electrical and thermal properties of Mo–Cu composites;Sun;J. Alloys Compd.,2016

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