Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation-Reference-Cited by-同舟云学术

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Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation

Published:2023-11 Issue: Volume:476 Page:146666
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Peng Jia-wan,Zhang Feng-lin,Zhou Yu-mei,Xiong Ling-kang,Huang Yao-jie,Tang Hong-qun

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

Reference53 articles.

1. Enhanced thermal conductivity interface by covalently bridging on Cu-Zn alloy with functionalized graphene through pulse electrodeposition;Wang;Thin Solid Films,2020

2. Largely enhanced thermal conductivity of graphene/copper composites with highly aligned graphene network;Chu;Carbon,2018

3. Present and future thermal interface materials for electronic devices;Razeeb;Int. Mater. Rev.,2018

4. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014

5. Diamond as an electronic material;Wort;Mater. Today,2008

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heat Dissipation Enhancement of High-Power Deep-Ultraviolet LEDs Through Plated Copper on Thick Film Diamond Substrates;IEEE Electron Device Letters;2024-09

2. Enhanced Heat Dissipation of High-Power InGaN Blue Laser Diode Through Diamond Substrates;IEEE Photonics Technology Letters;2024-08-15

3. Preparation and Property Modulation of Multi-Grit Diamond/Aluminum Composites Based on Interfacial Strategy;Metals;2024-07-09

4. Fabrication and heat dissipation performance of diamond/Cu composite with diamond bars inserted in the normal direction;Journal of Alloys and Compounds;2024-07

5. Tailoring intrinsic properties for tetrahedral carbon/copper composites construction via electronic interface engineering;Surfaces and Interfaces;2024-03

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