Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds
Author:
Funder
University of Queensland
Publisher
Elsevier BV
Subject
General Materials Science
Reference31 articles.
1. The monoclinic lattice distortion of η′-Cu6Sn5;Wieser;J. Alloys Compd.,2019
2. Structure-induced metastable phase transformation in Cu6Sn5 intermetallics;Zhang;Mater. Lett.,2019
3. Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint;Somidin;Materials (Basel),2018
4. Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain;Somidin;Mater. Charact.,2018
5. The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free ball grid array (BGA) solder joints;Zeng;J. Alloys Compd.,2016
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