In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

Author:

Tan Xin F.ORCID,Hao QichaoORCID,Zhou Jiye,Gu Qinfen,McDonald Stuart D.ORCID,Sweatman KeithORCID,Ikeda Masahiko,Yasuda Kazuhiro,Bermingham Michael J.ORCID,Nogita KazuhiroORCID

Funder

ANSTO

Japan Society for the Promotion of Science

The University of Queensland

Nihon Superior Co Ltd

Publisher

Elsevier BV

Subject

General Materials Science

Reference41 articles.

1. Low melting temperature Sn-Bi solder: effect of alloying and nanoparticle addition on the microstructural, thermal, interfacial bonding, and mechanical characteristics;Kang;Metals (Basel),2021

2. Recent progress on the development of Sn–Bi based low-temperature Pb-free solders;Wang;J. Mater. Sci. Mater. Electron.,2019

3. A review of lead-free solders for electronics applications;Cheng;Microelectron. Reliab.,2017

4. iNEMI project on process development of BISN-based low temperature solder pastes Part II: Characterization of mixed alloy BGA solder joints;Fu,2018

5. iNEMI. BiSn-Based Low-Temperature Soldering Process and Reliability. Available from: http://www.inemi.org/bi-sn_based_low_temp.

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