Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging-Reference-Cited by-同舟云学术

Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging

Published:2023-04 Issue: Volume:198 Page:112758
ISSN:1044-5803
Container-title:Materials Characterization
language:en
Short-container-title:Materials Characterization

Author:

Kim Dongjin,Kim Min-Su

Funder

Korea Institute of Industrial Technology

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference51 articles.

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4. Low-inductance double-sided cooling power module with branched Lead frame terminals for EV traction inverter;Tokuyama,2020

5. Power module platform for automotive reliability requirements;Pavlicek,2019

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