Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion
Author:
Funder
Japan Society for the Promotion of Science
China Scholarship Council
NEDO
Publisher
Elsevier BV
Reference27 articles.
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2. Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules;Kim;J. Mater. Sci. Mater. Electron.,2020
3. Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol;Bhogaraju;Scr. Mater.,2020
4. Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects;Zuo;Acta Mater.,2022
5. Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices;Chen;Acta Mater.,2017
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