Study on the reliability of novel Au–30Ga solder for high-temperature packaging-Reference-Cited by-同舟云学术

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Study on the reliability of novel Au–30Ga solder for high-temperature packaging

Published:2020-11 Issue:6 Volume:9 Page:15908-15923
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Liu Han,Xue Songbai,Tao Yu,Long Weimin,Zhong Sujuan,Wang Bo

Funder

State Key Laboratory of Advanced Brazing Filler Metals and Technology

Priority Academic Program Development of Jiangsu Higher Education Institutions

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference45 articles.

1. Reliability evaluation of SiC power module with sintered Ag Die attach and stress-relaxation structure;Sugiura;IEEE Trans Compon Packag Manuf Technol,2019

2. Thick film packaging techniques for 300°C operation;Zhang,2011

3. Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices;Chen;Acta Mater,2017

4. Development of Au-Ge based candidate alloys as an alternative to high-lead content solders;Chidambaram;J Alloys Compd,2010

5. Effects of γ-ray irradiation on microstructure and mechanical property of AuSn20 solder joint;Wen;J Mater Sci Mater Electron,2019

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2. Transient liquid phase bonding method of SnIn for high-temperature packaging;Journal of Materials Science: Materials in Electronics;2024-07

3. Effect of thermal exposure on microstructure, orientation relationship, residual stress and failure mechanism of ultrasonic-assisted Kovar/SnSb10/Kovar joints;Materials Characterization;2024-01

4. First-Principles Study of Mechanical Properties, Electronic Structure and High-Temperature and High-Pressure Properties of Au-Ga Intermetallic Compounds;2024

5. Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive;Materials Characterization;2023-09

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