1. A short review of through-silicon via (tsv) interconnects: metrology and analysis;Wang;Appl. Sci.,2023
2. Special issue “building three-dimensional integrated circuits and microsystems;Zhu;Processes,2023
3. A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-si-via and solder bumping process;Cho;Met. -basel,2021
4. Challenges and recent prospectives of 3d heterogeneous integration;Zhang;e-Prime-Adv. Electr. Eng. Electron. Energy,2022
5. Formation of cu nanotwins on silicon carbide wafers with cr adhesive layer under various substrate bias;Syafei;Metals,2023