Plasma density measurement and downstream etching of silicon and silicon oxide in Ar/NF3 mixture remote plasma source
Author:
Funder
R&D Convergence Program of National Research Council of Science and Technology (NST) of Republic of Korea
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Link
http://iopscience.iop.org/article/10.1088/2058-6272/ab0bd3/pdf
Reference29 articles.
1. Chemical downstream etching of tungsten
2. Downstream Etching of Si and SiO2Employing CF4/O2or NF3/O2at High Temperature
3. Remote plasma etching of silicon nitride and silicon dioxide using NF3/O2 gas mixtures
4. Review of inductively coupled plasmas: Nano-applications and bistable hysteresis physics
5. Ferromagnetic enhanced inductive plasma sources
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