Using convolutional neural network for intelligent SAM inspection of flip chips
Author:
Funder
National Natural Science Foundation of China
Publisher
IOP Publishing
Subject
Applied Mathematics,Instrumentation,Engineering (miscellaneous)
Link
https://iopscience.iop.org/article/10.1088/1361-6501/ac1615/pdf
Reference34 articles.
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2. Simulation and experimental investigation on active thermography test of the solder balls;Zhao;IEEE Trans. Ind. Inform.,2020
3. Optimization of through silicon via for three-dimensional integration;Du;Microelectron. Eng.,2015
4. Intelligent detection of flip chip with the scanning acoustic microscopy and the general regression neural network;Wang;Microelectron. Eng.,2019
5. Detection of micro solder balls using active thermography and probabilistic neural network;He;Infrared Phys. Technol.,2014
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