1. 余振华 中国 台积电 2023美国工程院院士 High Bandwidth and Energy Efficient Electrical-Optical System Integration Using COUPE Technology
2. 薛捷 美国 Cisco System Incorporated 2023美国工程院院士 Reliability of Microelectronics Packaging in the Era of EnergyWise and Borderless Networks
3. Emmanuel,Kymakis 希腊 Technological Educational Institute of Crete Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges
4. Ben Yoo, Sung-Joo 美国 University of California Davis LLM: Realizing Low-Latency Memory by Exploiting Embedded Silicon Photonics for Irregular Workloads
5. Seung-Boo,Jung 韩国 Sungkyunkwan University Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfaci..
6. Khodabakhshi, Farzad 伊朗 University of Tehran Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon na..
7. Seung-Boo,Jung 韩国 Sungkyunkwan University Interfacial reactions and mechanical properties of Sn-3.0Ag-0.5Cu solder with pure Pd or Pd(P) layer..
8. Seung-Boo,Jung 韩国 Sungkyunkwan University Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/th..
9. Michael G,Pecht 美国 University of Maryland Assembly Options and Challenges for Electronic Products With Lead-Free Exemption
10. Ben Yoo, Sung-Joo 美国 University of California Davis Enabling Scalable Disintegrated Computing Systems With AWGR-Based 2.5D Interconnection Networks
11. Ben Yoo, Sung-Joo 美国 University of California Davis 3D Photonics as Enabling Technology for Deep 3D DRAM Stacking
12. Cheung, Yiu-ming 中国 香港浸会大学 Fan-Out Wafer-Level Packaging for Heterogeneous Integration
13. Jamie J,Kruzic 澳大利亚 University of New South Wales Surface Finish Effects on Fracture Behavior of Sn-4Ag-0.5Cu Solder Joints
14. Junichi,Koike 日本 Tohoku University Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints
15. Eric,Chason 美国 Brown University In-situ synchrotron micro-diffraction study of surface, interface, grain structure, an..
16. Allan F,Bower 美国 Brown University In-situ synchrotron micro-diffraction study of surface, interface, grain structure, an..
17. Duh, Jenq-Gong 中国台湾 台湾清华大学 Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testin..
18. Yang Fu qian 美国 University of ROCHESTER Effect of DC current on tensile creep of pure tin
19. Bieler, Thomas R. 美国 Michigan State University Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn..
20. Duh, Jenq-Gong 中国台湾 台湾清华大学 Suppressing the growth of Cu-Sn intermetallic compounds in Ni/Sn-Ag-Cu/Cu-Zn solder joints during th..