Tribological Properties of Porous Cu Based Alloy Containing Nano Sized Sulfide Particles-Reference-Cited by-同舟云学术

Tribological Properties of Porous Cu Based Alloy Containing Nano Sized Sulfide Particles

Published:2012 Issue:1 Volume:6 Page:158-167
ISSN:1881-3054
Container-title:Journal of Advanced Mechanical Design, Systems, and Manufacturing
language:en
Short-container-title:JAMDSM

Author:

SATO Tomohiro¹,HIRAI Yoshimasa¹,FUKUI Takehisa¹,TANIZAWA Kazuki²,USAMI Hatsuhiko²

Affiliation:

1. Kurimoto Center for Innovative Technology, Kurimoto,LTD.

2. Department of Materials Science and Engineering, Meijo University

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://www.jstage.jst.go.jp/article/jamdsm/6/1/6_1_158/_pdf

Reference5 articles.

1. [1] Wakai,H., Sugitani,T.,Nishiuchi,H., Abe,H.,Hirose,K.,Matsubayashi,R., Maruyama,T. and Kobayashi,T.,Effect of Zn Contents on Properties of Sulfide Dispersed Lead Free Copper Alloy Castings, Proceedings of European Metallurgical Conference 2007, 4(2007-6),pp.2068-2069.

2. [2] Maruyama,T.,Wakai,H.,Abe,H. and Kobayashi,T.,Some Properties of Sulfide Dispersed Lead Free Copper Alloy Castings, Transactions of American Foundry Society, 116(2008), pp.299-307.

3. [3] Tosangthum,N.,Muangtong,P.,Coovattanachai,O.,Morakotjinda,M.,Yodkaew,T.,Wila,P., Krataitong,R.,Vetayanugul,B. and Tongsri,R., Effects of Tin Powder on Properties of Sintered Stainless Steels, Journal of Metals, Materials and Minerals, 18-1(2008-6), pp.47-51.

4. [4] Sato, T., Hirai, Y., Fukui, T., Tanizawa, K. and Usami, H., Tribological Properties of Porous Cu based Nano Sized Sulfide Particles, Proceedings of the 4^th Interantional Conference on Manufacturing, Machine Design and Triboligy, (2011-4), pp.137-138.

5. [5] Sato, T., Hirai, Y., Maruyama, T. and Kobayashi, T., Sintering Processes of Pb-Free Copper Alloy for Friction Materials, Procedings of Powder Metallurgy World Congress and Exhibition 2010, 2(2010-10), pp.313-319.

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