Process study on large-size silicon wafer grinding by using a small-diameter wheel-Reference-Cited by-同舟云学术

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Published:2015 Issue:5 Volume:9 Page:JAMDSM0073-JAMDSM0073
ISSN:1881-3054
Container-title:Journal of Advanced Mechanical Design, Systems, and Manufacturing
language:en
Short-container-title:JAMDSM

Author:

EBINA Yutaro¹,YOSHIMATSU Tomoya²,ZHOU Libo²,SHIMIZU Jun²,ONUKI Teppei²,OJIMA Hirotaka²

Affiliation:

1. Graduate School of Science and Engineering, Ibaraki University

2. Department of Intelligent Systems Engineering, Ibaraki University

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/jamdsm/9/5/9_2015jamdsm0073/_pdf

Reference12 articles.

1. Chen C.C.A. and Hsu L.S., A process model of wafer thinning by diamond grinding, Journal of Materials Processing Technology, Vol.201 (2008), pp.606-611.

2. Chen C.C.A. and Hsu L.S., 3D geometric model of wafer shape for diamond grinding of Si wafers, Journal of the Chinese Society of Mechanical Engineers, Vol. 27 (2006), pp.123-130.

3. Eda H, Zhou L, Nakano H, Kondo R, Shimizu J, Tajima T, Development of Single Step Grinding System for Large Scale φ300 Si Wafer, Journal of Precision Engineering, Vol.67, No.10(2001), pp.1693-1697 (In Japanese).

4. Huo F.W., Kang R.K., Li Z. and Guo D.M., Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers, International Journal of Machine Tools and Manufacture, Vol.66 (2013), pp.54-65.

5. Okahata G., Yui A., Kitajima T., Okuyama S., Saito H and Slocum H., Development of Rotary Work Table with Constant-flow Hydrostatic Water Bearing for Large Scale Silicon-wafer Grinding Machine, Advanced Materials Research, Vol 1017 (2014), pp.604-609.

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