1. U.S. Air Force Avionics Integrity Program notes, 1989.
2. Bar-Cohen, A., Kraus, A. D., and Davidson, S. F., June, 1983, “Thermal Frontiers in The Design and Packaging of Microelectronic Equipment,” Mechanical Engineering.
3. Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, McGraw-Hill, New York, N.Y.
4. Yeh, L. T., 1987 “Future Thermal Design and Management of Electronic Equipment,” Heat Transfer in High Technology and Power Engineering, Edited by Yang and Mori, Hemisphere Publishing, New York, N.Y.
5. Bergles, A. E., Chu, R. C., and Seely, J. H., Mar. 1977 “Survey of Heat Transfer Technologies Applied to Electronic Packages,” Proceedings of Technical Program National Electronic Packaging and Production Conference, Anaheim, CA.