On Moisture Diffusion Modeling Using Thermal-Moisture Analogy-Reference-Cited by-同舟云学术

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Published:2007-04-24 Issue:4 Volume:129 Page:421-426
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Yoon Samson¹,Han Bongtae¹,Wang Zhaoyang²

Affiliation:

1. Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, MD 20740

2. Department of Mechanical Engineering, The Catholic University of America, Washington, DC 20064

Abstract

Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) direct analogy and (2) normalized analogy. The schemes are implemented to define valid domains of application. The results corroborate that the direct analogy is valid only for single-material systems, but the normalized analogy can be extended to multimaterial systems if thermal loading conditions are isothermal, spatially as well as temporally.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/129/4/421/5803824/421_1.pdf

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