Thermal Joint Resistance of Polymer-Metal Rough Interfaces
Author:
Affiliation:
1. Department of Mechanical Engineering, University of Waterloo, Waterloo, ON, Canada N2L 3G1
2. Fellow ASME
3. Department of Mechanical Engineering, Texas A&M University, College Station, Texas 77813-3123
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/128/1/23/5884291/23_1.pdf
Reference17 articles.
1. Gurrum, S., Suman, S., Joshi, Y., and Fedorov, A., 2003, “Thermal Issues in Next Generation Integrated Circuits,” International Electronic Packaging Technical Conference and Exhibition, Paper No. IPack03-35309, July 6–11, Maui, Hawaii, USA, 2003.
2. Thermal Contact Conductance of Selected Polymeric Materials;Marotta;J. Thermophys. Heat Transfer
3. Thermal Conductance of Gasket Materials For Spacecraft Joints;Fletcher;Prog. Astronaut. Aeronaut.
4. Thermal Contact Resistance At Elastomer to Metal Interfaces;Parihar;Int. Commun. Heat Mass Transfer
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