1. Smart Chip, System and Data Center Enabled by Advanced Flexible Cooling Resources;Patel
2. Thermal Considerations in Cooling Large Scale High Computer Density Data Centers;Patel
3. Patel, C. D., and Shah, A. J., 2005, “Cost Model for Planning, Development and Operation of a Data Center,” Hewlett Packard Laboratories, Palo Alto, CA, Technical Report No. HPL-2005-107R1.
4. Sullivan, R. F.
, 2003, “Alternating Cold and Hot Aisles Provides More Reliable Cooling for Server Farms,” White Paper by The Uptime Institute, Santa Fe, NM.
5. American Power Conversion, 2003, “Avoidable Mistakes that Compromise Cooling Performance in Data Centers and Network Rooms,” White Paper 49 by American Power Conversion, Washington, DC.