Modeling and Experimental Study of a Wire Clamp for Wire Bonding
Author:
Affiliation:
1. State Key Laboratory of High Performance Complex Manufacturing, Changsha 410083, China e-mail:
2. School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4028836/6141044/ep_137_01_011012.pdf
Reference22 articles.
1. Experimental and Modeling Studies of Looping Process for Wire Bonding;ASME J. Electron. Packag.,2013
2. Variable-Length Link-Spring Model for Kink Formation During Wire Bonding;ASME J. Electron. Packag.,2013
3. Flexure Hinges for Piezoactuator Displacement Amplifiers: Flexibility, Accuracy, and Stress Considerations;Precis. Eng.,1996
4. A Microgripper Using Piezoelectric Actuation for Micro-Object Manipulation;Sens. Actuators A,2007
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