Micromachining of Metals, Alloys, and Ceramics by Picosecond Laser Ablation

Author:

Hu Wenqian1,Shin Yung C.1,King Galen B.1

Affiliation:

1. School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

Abstract

Microhole drilling and microstructure machining with a picosecond (ps) Nd:YVO4 laser (pulse duration of 10 ps) in metals, alloys, and ceramics are reported. Blind and through microholes are drilled by percussion drilling as well as trepanning drilling, where the diameters of the holes are in the range of 20–1000 μm. Microfeatures are also machined and the flexibility of ps laser machining is demonstrated. The quality of drilled holes, e.g., recast layer, microcrack, and conicity, and that of the microstructures, are investigated by an optical microscope, a surface profilometer, or a scanning electron microscope. Ps laser ablation rate is studied by experiments and a simplified laser ablation model.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference43 articles.

1. Microdrilling and Micromachining With Diode-Pumped Solid-State Lasers;Otani;Appl. Phys. A: Mater. Sci. Process.

2. Micromachining of Metals and Ceramics by Nano- and Picosecond Laser Radiation;Jandeleit;Proc. SPIE

3. Micro-Machining With Ultrashort Laser Pulses: From Basic Understanding to Technical Applications;Dausinger;Proc. SPIE

4. Practical Uses of Femtosecond Laser Micro-Materials Processing;Zoubir;Appl. Phys. A: Mater. Sci. Process.

5. Heat Affected Zone in Micro-Drilling of Metals by Femtosecond Laser Pulses;Le Harzic;Proc. SPIE

Cited by 43 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Investigation on femtosecond laser combined with dynamic wet etching machining of SiC/SiC;Journal of the European Ceramic Society;2024-09

2. Machining technologies and structural models of microfluidic devices;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2024-03-23

3. Numerical Study of Temperature and Plasma Field in Laser Ablation of Inconel 718 superalloy;2023 First International Conference on Advances in Electrical, Electronics and Computational Intelligence (ICAEECI);2023-10-19

4. Surface microstructure evolution of Cf/SiC ceramic matrix composite microgrooves processed by ultrafast laser;Ceramics International;2023-09

5. Investigation of Cutting Force and the Material Removal Mechanism in the Ultrasonic Vibration-Assisted Scratching of 2D-SiCf/SiC Composites;Micromachines;2023-06-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3