Double-Layer Microchannel Heat Sinks With Transverse-Flow Configurations-Reference-Cited by-同舟云学术

Double-Layer Microchannel Heat Sinks With Transverse-Flow Configurations

Published:2016-05-19 Issue:3 Volume:138 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Ansari Danish¹,Kim Kwang-Yong²

Affiliation:

1. Department of Mechanical Engineering, Graduate School of Inha University, Incheon 402-751, South Korea e-mail:

2. Professor Fellow ASME Department of Mechanical Engineering, Inha University, Incheon 402-751, South Korea e-mail:

Abstract

The performances of various transverse-flow double-layer microchannel heat sink configurations were evaluated compared to those of parallel-flow heat sink configurations via conjugate heat transfer analysis. For the analysis, three-dimensional Navier–Stokes and energy equations for steady incompressible laminar flow were solved using a finite-volume solver. Water with temperature-dependent thermophysical properties was used as a coolant. The thermal resistances were evaluated for various flow configurations of both cross-channel and parallel-channel designs with identical geometric parameters and total flow rate. Changes in the microchannel flow direction lead to remarkable changes in thermal resistance and temperature uniformity. A transverse-flow configuration exhibited the best overall performance among the tested flow configurations in terms of the thermal resistance, temperature uniformity, and pressure drop.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4033558/6142272/ep_138_03_031005.pdf

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