Thermal Analysis of the Grinding Process

Abstract

A theoretical thermal analysis of the grinding process is developed. The investigation considers temperature in the vicinity of chip formation and relates this temperature to the temperature experienced by the workpiece surface which remains after grinding. The relation is established by considering grinding geometry. The results indicate that temperatures predicted at the region of chip formation can be substantially greater than those which result on the surface of the remaining workpiece. Furthermore, the temperature in the workpiece at a distance of several ten-thousands below the surface are virtually unaffected by chip shear plane temperature.