Affiliation:
1. School of Electronics Engineering (SENSE), Vellore Institute of Technology (VIT) Chennai Campus, Chennai, Tamil Nadu, India
2. Center for Innovation and Product Development (CIPD), Vellore Institute of Technology (VIT) Chennai Campus, Chennai, Tamil Nadu, India
Abstract
Electrochemical discharge machining (ECDM) processes have been used to realize miniature structures such as micro-channels and micro-holes on non-conductive materials such as quartz and Pyrex for a variety of applications. However, for realizing mechanical/physical sensors, actuators, energy harvesters, and resonators on glass substrates, free-standing devices with movable components such as beam-mass structures and cantilevers are required. There has been a negligible focus on developing miniature glass-based devices with movable components primarily due to the non-linear material removal rate (MRR) of the ECDM processes, requiring continuous measurement, tracking, and maintaining the working gap in the range of a few micrometers during micromachining. A couple of techniques were proposed to address maintaining a constant working gap, however, using costly equipment with complex feedback mechanisms. We report a two-stage experimental approach – without using feedback mechanisms and additional equipment – to realize micro-mechanical planar cantilever beam-mass structures on thick quartz substrates in the present work. In the first stage, the process parameters such as applied voltage, tool travel rate (TTR), and initial working gap ( Wg) are optimized for fabricating broader and deeper micro-channels using needle-shaped tools. In the second stage, using the optimized parameters, an array of micro-channels is fabricated. The cumulative depth, corresponding depth, and the width of each layer of the channels are measured, and this data is utilized for fabricating planar beam-mass structures on quartz substrates. We envisage that the experimental results of the present study would be beneficial for ECDM researchers to fabricate glass-based miniature devices with movable components without using complex tools and equipment.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Cited by
5 articles.
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