Analytical solution for thermal stresses in a hollow cylinder under periodic thermal loading

Author:

Mahmoudi Hamid1,Atefi Gholamali1

Affiliation:

1. Department of Energy Conversion, School of Mechanical Engineering, Iran University of Science and Technology, Tehran, Iran

Abstract

The aim of this article is to obtain a comprehensive analytical solution for thermal stresses in a hollow cylinder, subjected to periodic time-varying thermal loading on the inner circular and insulated outer circular surfaces, where both lateral surfaces are kept at constant temperature. Temperature distribution as a function of time, and radial, and longitudinal directions is analytically solved using Fourier series and the resulting thermal stresses are obtained. The proposed method is very comprehensive and covers many theoretical and practical problems. The results for both temperature field and thermal stresses have been compared with those obtained in the former works and show excellent agreement for the same conditions.

Publisher

SAGE Publications

Subject

Mechanical Engineering

Reference25 articles.

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3. Özisik MN. Heat conduction, 2nd ed. New York: John Wiley, 1993, pp. 99–149.

4. Transient thermal stresses in a hollow cylinder subjected to γ-ray heating and convective heat losses

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