Linear Two-Axis MOEMS Sun Sensor and the Need for MEMS in Space
Author:
Affiliation:
1. ESA Student
Publisher
American Institute of Aeronautics and Astronautics
Link
http://arc.aiaa.org/doi/pdf/10.2514/6.IAC-03-U.2.b.02
Reference7 articles.
1. Matthias Heschel. Multiple Through-Wafer Interconnects for Stacking of Microelectromechanical Devices. PhD thesis, Mikroelektronik Centret (MIC) atThe Technical University of Denmark, 1999.
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