Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
11 articles.
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1. A High-Precision Delay Faults Testing Technique Based on the Improved DWR Structure;2023 8th International Conference on Integrated Circuits and Microsystems (ICICM);2023-10-20
2. An Effective Faulty TSV Detection Scheme for TSVs in High Bandwidth Memory;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21
3. Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-01
4. An ILD Void Detection Method for Monolithic 3D ICs Based on Switched Capacitors;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022
5. Kelvin Bridge Structure Based TSV Test for Weak Faults;2021 IEEE International Test Conference in Asia (ITC-Asia);2021-08-18