A Force-Directed-Based Optimization Scheme for Thermal Placement Design of MCMs
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx5/6040/4084580/04084585.pdf?arnumber=4084585
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fast optimization of multichip modules using deep learning coupled with Bayesian method;International Communications in Heat and Mass Transfer;2023-02
2. Optimal Thermal Placement and Loss Estimation for Power Electronic Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-02
3. A particle swarm optimization approach in printed circuit board thermal design;Integrated Computer-Aided Engineering;2017-03-06
4. Robust Design Analysis on Fatigue Life of Lead-Free Sn0.5Ag Solder in a Multichip Module Package;Applied Mechanics and Materials;2013-01
5. Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-05
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