Integrated Power Delivery Methodology for 3D ICs-Reference-Cited by-同舟云学术

Integrated Power Delivery Methodology for 3D ICs

Published:2022-04-06 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Symposium on Quality Electronic Design (ISQED)
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Author:

Safari Yousef¹,Vaisband Boris¹

Affiliation:

1. McGill University,The Heterogeneous Integration Knowledge (THInK) Team,Department of Electrical and Computer Engineering,Montreal,QC,Canada,H3A 0E9

Funder

Natural Sciences and Engineering Research Council of Canada

Nature

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9806045/9806137/09806286.pdf?arnumber=9806286

Reference29 articles.

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2. A 500 MHz, 68% efficient, fully on-die digitally controlled buck Voltage Regulator on 22nm Tri-Gate CMOS

3. A 2.5D Integrated Voltage Regulator Using Coupled-Magnetic-Core Inductors on Silicon Interposer

4. A Digitally Controlled Fully Integrated Voltage Regulator with 3D-TSV based On-Die Solenoid Inductor with Backside Planar Magnetic Core in 14nm Tri-gate CMOS;krishnamurthy;Symposium on VLSI Technology,2017

5. A Digitally Controlled Fully Integrated Voltage Regulator With 3-D-TSV-Based On-Die Solenoid Inductor With a Planar Magnetic Core for 3-D-Stacked Die Applications in 14-nm Tri-Gate CMOS

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1. Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms;Proceedings of the Great Lakes Symposium on VLSI 2024;2024-06-12

2. P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05

3. Power gate resistance and its effect on loadline: Measurement and analysis on Intel® Core™ SoCs;2023 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT);2023-07-14

4. ARTSim: A Robust Thermal Simulator for Heterogeneous Integration Platforms;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. A Robust Integrated Power Delivery Methodology for 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-03